Singapore-based startup Nexstrom has announced the development of process technologies aimed at efficiently integrating next-generation 2D semiconductor materials into current semiconductor fabrication lines (fabs).
The company is currently developing processes to adapt atomically thin 2D materials to existing silicon-based chip manufacturing workflows. Compared to conventional materials, 2D semiconductors boast superior physical properties and are highly anticipated as the next major breakthrough in chip manufacturing, where traditional scaling is rapidly approaching its physical limits.
As the semiconductor industry struggles to sustain Moore's Law, a fundamental shift in materials science is desperately needed. Due to their atomic-scale thickness, 2D semiconductors offer the potential to deliver both high charge carrier mobility and exceptional switching performance. Nexstrom aims to build the manufacturing technologies required to bridge the gap between lab-scale research of these advanced materials and commercial mass-production lines.
Nexstrom is prioritizing the establishment of an integration process that places compatibility with existing fab equipment at the forefront. Moving forward, the company plans to focus on process validation for mass production, aiming to preserve the unique characteristics of 2D semiconductors while maintaining manufacturing efficiency.